this is information on a product in full production. november 2015 docid024657 rev 4 1/10 10 BAL-CC25-01D3 50 ohm, conjugate ma tch to cc253x, cc254x, cc257x, cc852x, cc853x, transformer balun datasheet ? production data features ? 2.45 ghz balun with integrated matching network ? matching optimized for following chip-sets: ? cc2530, cc2531, cc2533 ? cc2540 ? cc2543, cc2544, cc2545 ? cc2570, cc2571 ? cc8520, cc8521 ? cc8530, cc82531 ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? coated flip-chip on glass ? small footprint: < 0.88 mm2 benefits ? very low profile ? high rf performance ? pcb space saving versus discrete solution ? bom count reduction ? efficient manufacturability description stmicroelectronics BAL-CC25-01D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. this has been customized for the cc25xx and cc85xx rf transceivers. it?s a design using stmicroelectronics ipd (integrated passive devi ce) technology on non- conductive glass substrate to optimize rf performance. figure 1. pin configuration (top view) figure 2. application schematic (top view) ) o l s & k l s s d f n d j h e x p s v se gnd rf_n rf_p & & & & & & & & & & & & & & & & & & & & & & & & & & 3 r z h u 6 x s s o \ 2 s w l r q d o i l o w h u l q j 5 ) b 1 5 ) b 3 6 ( * 1 ' 5 ) b 1 5 ) b 3 = % $ / & & ' www.st.com
characteristics BAL-CC25-01D3 2/10 docid024657 rev 4 1 characteristics table 1. a bsolute maximum rating (limiting values) symbol parameter value unit min. typ. max. p peak input power rf in 20 dbm v esd esd ratings mil std883c (hbm: c = 100 pf, r = 1.5 k ??? air discharge) 2000 v esd ratings machine model (mm: c = 200 pf, r = 25 ???? l = 500 nh) 500 esd ratings charged device model (cdm, jesd22-c101d) 500 t op operating temperature -40 +125 oc table 2. electrical characteristics - rf performance (t amb = 25 c) symbol parameter value unit min. typ. max. z out nominal differential output impedance conjugate match to cc25xx, cc85xx ? z in nominal input impedance f frequency range (bandwidth) 2379 2507 i l insertion loss in bandwidth 0.66 db r l_se single ended return loss in bandwidth 19 db r l_diff differential ended return loss in bandwidth 19 db ? imb phase imbalance 14 a imb amplitude imbalance 0.3 db
docid024657 rev 4 3/10 BAL-CC25-01D3 ch aracteristics figure 3. insertion loss (t amb = 25 c) figure 4. return loss (t amb = 25 c) figure 5. return loss (t amb = 25 c) -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 2.38 2.40 2.42 2.44 2.46 2.48 2.50 2.52 il (db) f ( hz) g -22.5 -20 -17.5 -15 -30 rl_se ( ) db -12.5 -27.5 -10 -25 2.38 2.40 2.42 2.44 2.46 2.48 2.50 2.52 f ( hz) g -22.5 -20 -17.5 -15 -30 rl_diff ( ) db -12.5 -27.5 -10 -25 2.38 2.40 2.42 2.44 2.46 2.48 2.50 2.52 f ( hz) g
characteristics BAL-CC25-01D3 4/10 docid024657 rev 4 figure 6. amplitude imbalance (t amb = 25 c) figure 7. phase imbalance (t amb = 25 c) 0.0 0.1 0.2 0.3 ampl( ) db 0.4 0.5 2.38 2.40 2.42 2.44 2.46 2.48 2.50 2.52 f ( hz) g 0.0 12.5 2.5 15 5 17.5 7.5 10 20.0 2.38 2.40 2.42 2.44 2.46 2.48 2.50 2.52 f ( hz) g phase( eg) d
docid024657 rev 4 5/10 BAL-CC25-01D3 pack age information 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. 2.1 flip-chip pa ckage information figure 8. flip-chip package outline table 3. flip-chip p ackage mechanical data parameter description min. typ. max. unit a bump height + substrate thickness 0.570 0.630 0.690 mm a1 bump height 0.155 0.205 0.255 mm a2 substrate thickness 0.400 mm b bump diameter 0.215 0.255 0.295 mm d y dimension of the die 0.890 0.940 0.990 mm d1 y pitch 0.500 mm e x dimension of the die 0.890 0.940 0.990 mm e1 x pitch 0.500 mm se 0.250 mm fd distance from bump to edge of die on y axis 0.220 mm fe distance from bump to edge of die on x axis 0.220 mm ccc 0.05 mm $0.025mm $ $ % r w w r p y l h z v l g h y l h z i ' ' ( 7 r s y l h z ' $ f f f ' & & i ( 6 ( ( $ $ % ? e %
package information BAL-CC25-01D3 6/10 docid024657 rev 4 figure 9. footprint p p p p p p " # figure 10. footprint - 3 mils stencil -non solder mask defined figure 11. footprint - 3 mils stencil - solder mask defined & r s s h u s d g g l d p h w h u ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u p d v n r s h q l q j ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u v w h q f l o r s h q l q j ? p u h f r p p h q g h g & r s s h u s d g g l d p h w h u ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u p d v n r s h q l q j ? p u h f r p p h q g h g ? p p l q l p x p 6 r o g h u v w h q f l o r s h q l q j ? p u h f r p p h q g h g figure 12. footprint - 5 mils stencil -non solder mask defined figure 13. footprint - 5 mils stencil - solder mask defined
g h s h q g l q j r q s d v w h l w f d q j r g r z q w r ? p & r s s h u s d g g l d p h w h u ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u p d v n r s h q l q j ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u v w h q f l o r s h q l q j ? p u h f r p p h q g h g
g h s h q g l q j r q s d v w h l w f d q j r g r z q w r ? p & r s s h u s d g g l d p h w h u ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u p d v n r s h q l q j ? p u h f r p p h q g h g ? p p l q l p x p 6 r o g h u v w h q f l o r s h q l q j ? p u h f r p p h q g h g
docid024657 rev 4 7/10 BAL-CC25-01D3 pack age information figure 14. pcb layout recommendation figure 15. marking note: more information is available in the stmicroelectronics application note: an2348 flip-chip: ?package description and recommendations for use? 250 m 127 m gnd aperture 100 m 280 m 850 m 850 m pad diameter 250m x y x w z w dot, st logo ecopack grade xx = marking z = manufacturing location yww = datecode (y = year ww = week)
package information BAL-CC25-01D3 8/10 docid024657 rev 4 figure 16. flip chip tape and reel specifications note: more information is ava ilable in the application note: an2348: ?flip chip: package descri ption and recommendations for use? dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 0.1 2.0 0.05 2.0 0.05 8.0 0.3 1.75 0.1 3.5 0.05 ? 1.55 0.10 0.73 0.05 1.0 0.05 0.20 0.015 1.0 0.05 st st st x x z y w w x x z y w w x x z y w w st st st st x x z y w w x x z y w w x x z y w w x x z y w w
docid024657 rev 4 9/10 BAL-CC25-01D3 ordering information 3 ordering information 4 revision history table 4. ordering information order code marking package weight base qty delivery mode BAL-CC25-01D3 sl flip chip 1.07 mg 5000 tape and reel (7?) table 5. document revision history date revision changes 23-may-2013 1 initial release 11-jul-2013 2 updated figure 14. 04-sep-2015 3 updated figure 8. added figure 10, figure 11, figure 12, figure 13 and table 3. 12-nov-2015 4 updated table 1 .
BAL-CC25-01D3 10/10 docid024657 rev 4 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2015 stmicroelectronics ? all rights reserved
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